Samsung Hits 90% Yield in HBM4 Logic Die — The Race for AI Memory Supremacy Accelerates
Samsung Electronics has achieved a major milestone in the race for next-generation AI memory. Its HBM4 logic die,…
Read MoreSemicon
Taiwan’s “AI New Ten Major Constructions”: Building a Silicon Photonics Hub in Kaohsiung
Spot The Taiwanese government has launched a new national initiative called “AI New Ten Major Constructions.” Its main…
Read MoreSamsung’s 2nm Breakthrough: How Korea Is Narrowing the Gap with TSMC
As of October 2025, Samsung is entering the decisive stage of preparing for next-generation 2-nanometer (nm) system semiconductor…
Read MoreKAIST’s PIMBA Chip: Korea’s Breakthrough Memory-Inside AI Architecture
Spot: Korea’s KAIST broke the memory bottleneck by bringing computation into the memory itself. Pulse: In the Post-Transformer…
Read MoreAI Semiconductors at a Turning Point: ASIC and HBM Redefine Performance
The Current Landscape and Strategic Direction of the Global AI Chip Industry The global AI semiconductor market in…
Read MoreAI Semiconductor Supply Chain at a Crossroads: How the U.S.–China Trade War 2.0 Redefines Global Manufacturing
Spot: Washington is broadening export restrictions from hardware to software, while Beijing is countering with licensing regimes and…
Read MoreChina Tightens Grip on Battery Exports — Full-Chain Control Arrives
The Bottom Line Spot: Beijing has introduced a sweeping export-licensing system for lithium-ion batteries, their materials, manufacturing equipment,…
Read MoreHuawei’s Great Compute Leap: How the Ascend Roadmap Signals China’s Race for AI Hardware Sovereignty
Key Takeaways Huawei Accelerates Computing Sovereignty — With the Ascend 950–970 roadmap and its new “SuperNode” architecture, Huawei…
Read MoreHyundai Mobis Declares In-House Automotive Semiconductor Strategy
A Market on the Edge of Transformation The automotive world is quietly but rapidly moving into a new…
Read More
